By Kalwinder Kaur
XIMEA has launched xiCOP USB3.0 diagnostic software integrated within the xiQ series of ultracompact USB3.0 industrial cameras. This innovative software is capable of detecting and removing data bottlenecks in new USB3.0 SuperSpeed standard-based machine vision systems.
Using vendor’s knowledge base, machine vision system designers procuring USB2.0 and USB3.0 cameras can investigate and incorporate the ideal cables, hubs, and controllers within the specific camera. This process has been made easy with XIMEA, wherein it assembles the knowledge base followed by packing it within the xiCOP interactive optimization and diagnostic software program. This convenient packaging method promotes cost efficiency to the end users, while providing time efficiency to the integrators.
Being the smallest yet fastest USB3.0 cameras enhancing industrial imaging and machine vision performance, XIMEA’s xiQ industrial cameras are developed to the latest USB3.0 SuperSpeed data interface standard that generates up to 5 Gbps of data, allowing image transfers of up to 400 Mpix/s.
With only 26 g weight and measuring 26.4x26.4x19.1 mm, the xiQ series possesses all the standard I/O and features required by industrial imaging customers. xiQ series cameras consist of an extensive variety of high-grade CMOS sensors with VGA- 4 Mpix resolution ranges, global shutters, enhanced quantum efficiency (QE) in the visible and NIR spectral ranges, and frame rates reaching 600 fps. A high dynamic range (HDR) model ensures maximum sensitivity having dynamic range extending to100 dB.
Besides the highly-compact size, efficient frame rates, and excellent resolution, the xiQ cameras provide OEMs single PCB construction rather than multiple flexible PCBs, simplifying the integration of xiQ within OEM designs and specialized equipment.