Sonoscan Ships Automated 300 mm Bonded Wafer Inspection System

Sonoscan has started shipping its 300 mm bonded wafer inspection system that is automated and capable of scanning two wafers at the same time. The users are benefitted by the double throughput output from the inspection system.


The system conducts a thorough inspection of the wafer pairs, which are used in SOI, MEMS and other applications. The wafers that are inspected by the system are 300 mm and 200 mm wafers, which are virtually bonded by any technique. The defects that are checked by the system are disbonds, voids, delaminations, cracks of any depth and particles present at the bond interface.

The AW300TM is an inspection system, which is based on the C-SAM acoustic microscope systems from Sonoscan. The AW300TM automates the complete inspection system right from attaching the carrier and selecting the wafer to drying, sorting and acoustic imaging. The wafers are loaded onto two ports, which are compatible with FOUP or FSOB carriers by the robotic arm. The wafers are fed into one of the two scanners. In order to ensure a maximum output, the wafers are arrayed in a staging area where they are processed and amassed provisionally. The inspection system uses transducers from Sonoscan that have a frequency range of 100 to 400 MHz. The ultra-high frequency transducers from Sonoscan are matched, manufactured and designed internally in order to achieve the most favourable performance.

The inspection system, AW300, has the capability of detecting voids in inter-wafers, which are as small as 5 µ and very thin delaminations in the order of 100A. For scanning the wafers, the inspection system uses WaterfallTM transducers that non immersive and some of the stages are vacuum assisted. The software measures the bonded and the unbounded interfaces between the two wafers and the number and sizes of the voids. The decision to reject or accept a wafer is taken automatically as per the specific criteria of the user.



Please use one of the following formats to cite this article in your essay, paper or report:

  • APA

    Choi, Andy. (2019, February 20). Sonoscan Ships Automated 300 mm Bonded Wafer Inspection System. AZoRobotics. Retrieved on April 16, 2024 from

  • MLA

    Choi, Andy. "Sonoscan Ships Automated 300 mm Bonded Wafer Inspection System". AZoRobotics. 16 April 2024. <>.

  • Chicago

    Choi, Andy. "Sonoscan Ships Automated 300 mm Bonded Wafer Inspection System". AZoRobotics. (accessed April 16, 2024).

  • Harvard

    Choi, Andy. 2019. Sonoscan Ships Automated 300 mm Bonded Wafer Inspection System. AZoRobotics, viewed 16 April 2024,

Tell Us What You Think

Do you have a review, update or anything you would like to add to this news story?

Leave your feedback
Your comment type

While we only use edited and approved content for Azthena answers, it may on occasions provide incorrect responses. Please confirm any data provided with the related suppliers or authors. We do not provide medical advice, if you search for medical information you must always consult a medical professional before acting on any information provided.

Your questions, but not your email details will be shared with OpenAI and retained for 30 days in accordance with their privacy principles.

Please do not ask questions that use sensitive or confidential information.

Read the full Terms & Conditions.