Aug 21 2010
Agilent Technologies Inc., a company that designs and manufactures electronic and bio-analytical measurement instruments, has released the integrated circuit characterization and analysis program (IC-CAP) wafer professional (WaferPro) software. The software offers a turn-key solution to help engineers of device modeling in achieving more efficient on-wafer measurements across temperature ranges.
The main features of the software include automation of DC and RF calculations in spot and swept modes across various ranges of temperature across multiple wafers and multiple sites. The software can effectively handle both fully-automatic and semi- automatic probes and can support advanced switch matrixes and thermal chucks. It can also control the 4070 and 4080 series of parametric testers from Agilent and this helps in quick measurement, efficient organization and quick analysis of data, automation of the wafer realignment process whenever a change in temperature occurs. WaferPro ensures seamless execution of test cases on various test stations with various types of hardware, thereby reducing manual work and permitting maximization of lab equipment use. The software has been developed on an advanced architecture and thereby offers a platform for advanced analysis and modeling in the future.
WaferPro is made available with Agilent’s IC-CAP 2010.08 software. Chris Morton, manager of the device modeling business of Agilent EEsof EDA, stated that challenges in modeling devices is on the rise, and continues to be a major area of concern for designers who handle intricate applications. The incorporation of Agilent parametric systems in modeling applications is expected to greatly assist the automation of production process.