The panel measuring table supplies fast information on the etching distribution after differential etching processes or on the thickness of copper plating. The measurements are carried out fully automatically by a sensor after entering the panel size, minimum measuring distance from panel edge, and number of measuring points in x and y direction.
Inline system for fast, precise measurement of copper-plate thickness on PCBs and for the adjustment and monitoring of etching systems
- Easy and precise adjustment of etching and plating systems.
- Quick checking of existing settings.
- Wrong settings are easily detected and corrected.
- Reduction of error ratio by early fault detection.
- Possible to reproduce parameter settings.
- Easy handling.
- Clearly structured evaluation.
- Little space required.