Posted in | Packaging Automation

PackExpo International Show to Feature Robotic Pick + Glue Systems

QComp Technologies in collaboration with Hayssen Sandiacre has developed a new robotic Pick & Glue packaging system which will be showcased in booth S-806 at PackExpo International Show in Chicago from October 31 to November 3.

The proficiency and experience of this partnership will offer highly sophisticated packing strategies for Pick & Glue products for pouch assembly and retail marketing offers.

Tom Doyle, President of QComp Technologies, Inc has stated that packagers requiring cost-efficient modular layouts handling multifarious products should participate in the PackExpo for experiencing QComp’s High Speed pick & glue system and the Hayssen Form/ Fill/ Seal Machine. He added that by linking their vision-enabled packaging systems with the proficiency of Hayssen, they can provide the most competent and cost-efficient packaging technology to their clients, thereby profoundly enhancing their investment returns.

Source: http://www.qcomptech.com

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