IMAPS 2015: NEO Tech Highlights Advanced Microelectronics Assembly Technology

NEO Tech, a global supplier of electronic manufacturing services, today announced they are showcasing their advanced microelectronics assembly technology at the IMAPS 2015 conference taking place on October 27th thru 29th , 2015 in Orlando, FL. NEO Tech is proud to be the Platinum Sponsor for IMAPS 2015.

The International Microelectronics Assembly and Packaging Society (IMAPS) is the largest society dedicated to the advancement and growth of microelectronics and electronics packaging technologies.

NEO Tech is showcasing recent advancements that have made them the industry leader in advanced high-reliability substrate and microelectronics manufacturing. Examples include new AUTO Line technology—a hands free continuous, contiguous, automatic assembly process—that delivers high repeatability and near zero rework. In substrates NEO Tech also continues to deliver advances in high density and high layer LTCC substrates that are applied in mission critical high-frequency RF transceiver modules.

“The AUTO Line is a game changer,” stated Jim Angeloni, NEO Tech Chief Operating Officer, Aerospace and Defense Operations. “NEO Tech invested in the AUTO Line to stay ahead of the curve in technology and to offer designers of high-reliability devices demanding very high quality, a level of cost-effectiveness rivaling offshore sources.”

To learn more about these and other advanced microelectronics and packaging technology please find the NEO Tech team at Booth 505 at IMAPS 2015.


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