Flexicell, a leading supplier of robotic solutions for packaging industry, will demonstrate its robotic collating, picking and palletizing products in booth 3651 at PACK EXPO 2010, which will be held at the McCormick Place, Chicago, between October 31 and November 3.
QComp Technologies in collaboration with Hayssen Sandiacre has developed a new robotic Pick & Glue packaging system which will be showcased in booth S-806 at PackExpo International Show in Chicago from October 31 to November 3.
Schneider Packaging Equipment Co has launched Robotic Accumulator Loader (RAL) Case Packer for multifarious packing procedures to increase its overall reliability.
QComp Technologies, a major robotics integrating company, has declared its collaboration with Combi Packaging Systems for enhancing the robotic case packing technology. The combination of technical proficiency of these two companies will offer high-end procedures for their clients in pre-sorting mixed products involved in case and tray parking.
Schneider Packaging Equipment Co., Inc has launched a range of heavy duty robotic palletizers ideal for frozen processing environments involving sub zero temperatures.
Adept Technology, a global supplier of intelligent robotic solutions, has declared that its mobile platform technology featuring innovative navigation features will be demonstrated at the Pack Expo 2012, which will be held in booth N-4313 at McCormick Place Convention Center, Chicago between October 31 and November 3.
Adept Technology, a global provider of intelligent robotics, has released a Packaging Automation Cell (PAC), a new automated packaging platform for expeditious packaging applications like meat and poultry packaging which demands both hygienic and adaptable processing.